High-speed data movement will be required in future vehicles, probably including optical, but challenges persist.

With functional verification consuming more time and effort than design, the chip industry is looking at every possible way to make the verification process more effective and more efficient.

UALink data exchange and control; AI sovereignty; 3D-IC thermal behavior; UART security; SystemVerilog coverage extensibility ...

AI data centers are starting to replace copper with co-packaged optics in an effort to reduce energy consumed per bit and ...

AI workloads require rapid access to vast amounts of data, made possible by integrating HBMs. This approach, combining two, ...

A new technical paper, “Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review,” was published by University of Austria and ETH Zurich. Abstract “This review examines the ...

A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was ...

As ATE systems become increasingly complex and data-intensive, traditional rule-based optimization methods struggle to keep ...

Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now ...

Three AI data center scaling strategies are scale-up, scale-out, and scale-across. Scale-up is within a rack; scale-out is ...

Liquid cooling is proving effective at cooling high-power chips, such as GPUs, but it’s creating thermal issues for other ...

Cloud-based AI dominates the headlines, but responsive and private interaction lies at the edge. This blog post shows how to build a fully offline, real-time voice assistant using the Arm-based NVIDIA ...